Power and Thermal Management Issues for Portable Processors
DOI:
https://doi.org/10.21271/ZJPAS.32.4.9Keywords:
Portable Systems, Microprocessors; Thermal management; Heatsink Design; Power Dissipation minimization.Abstract
The advancement of modern CMOS technology scaling causes an exponential rise of system's power dissipation and temperatures in submicron technology node, which growth production and operating costs. Thermal energy and generated heat are becoming a prominent major issue in the context of portable applications (telephony, PDAs, digital cameras ...) and must be considered at each design level. The performance of portable processors is critically affected by dissipated power and operational temperature. The designers are forced to design a proper cooling system, especially heatsinks which consistently allows a low power and low temperature regulation of high-speed processors.
In this article, several different heatsinks are modeled, tested, and designed to optimize the microprocessor’s cooling system while ensuring proper thermal operation and lowest power dissipation. The proposed adopted heatsink and their selected design configurable parameters are analyzed theoretically for different validations conditions and operation modes in various real-time thermal conditions. Thermal Analysis Package is used for simulation the proposed heatsinks model. Results shows the specification improvements of the design model for ensuring power required to cool in time of 0.851 W, time to cool by 15s, and heat to remove is 12.77J which confirms theoretical fundamentals and sufficient improvement of temperature minimization and better performance of the cooling system was achieved.
References
AHMED, H. E., SALMAN, B., KHERBEET, A. S. & AHMED, M. 2018. Optimization of thermal design of heatsinks: A review. International Journal of Heat and Mass Transfer, 118, 129-153.
DEDE, E. M., LIU, Y., JOSHI, S. N., ZHOU, F., LOHAN, D. J. & SHIN, J.-W. 2019. Optimal design of three-dimensional heat flow structures for power electronics applications. Journal of Thermal Science and Engineering Applications, 11.
FORNACIARI, W. & SOUDRIS, D. 2019. Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms, Springer.
GIERCZAK, M., MARKOWSKI, P. & DZIEDZIC, A. Modeling, simulation and analysis of temperature distribution in a heatsink. 2016 39th International Spring Seminar on Electronics Technology (ISSE), 2016. IEEE, 122-127.
HAMAALI, G., R. SULAIMAN, D. & IBRAHIM, M. 2019. Power and thermal management in SRAM and DRAM using adaptive body biasing technique. IEICE Electronics Express, 16.20190432.
HANAFI, M. Z. M., ISMAIL, F. S. & ROSLI, R. Radial plate fins heatsink model design and optimization. 2015 10th Asian control conference (ASCC), 2015. IEEE, 1-5.
ILSCHE, T., SCHÖNE, R., SCHUCHART, J., HACKENBERG, D., SIMON, M., GEORGIOU, Y. & NAGEL, W. E. 2019. Power measurement techniques for energy-efficient computing: reconciling scalability, resolution, and accuracy. SICS Software-Intensive Cyber-Physical Systems, 34, 45-52.
MARKOWSKI, P. M., GIERCZAK, M. & DZIEDZIC, A. 2019. Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heatsink. Micromachines, 10, 556.
MJALLAL, I., FARHAT, H., HAMMOUD, M., ALI, S. & ASSI, I. 2018. Improving the cooling efficiency of heatsinks through the use of different types of phase change materials. Technologies, 6, 5.
NEYESTANI, M., NAZARI, M., SHAHMARDAN, M., SHARIFPUR, M., ASHOURI, M. & MEYER, J. 2019. Thermal characteristics of CPU cooling by using a novel porous heatsink and nanofluids. Journal of Thermal Analysis and Calorimetry, 138, 805-817.
R. SULAIMAN, D., HAMARASH, I. & IBRAHIM, M. 2017. Adaptive supply and body voltage control for ultra-low power microprocessors. IEICE Electronics Express, 14, 20170306-20170306.
ROTEM, E., GINOSAR, R., MENDELSON, A. & WEISER, U. C. Power and thermal constraints of modern system-on-a-chip computer. 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2013. IEEE, 141-146.
RUPP, K. 40 years of microprocessor trend data. GitHub, 2018.
SINGH, V., DAS, H. C. & NEMALIPURI, P. 2020. Numerical Analysis of Heat Transfer and Fluid Flow in Mini-channel Heatsink with Interconnecting Channels. Advances in Mechanical Engineering. Springer.
SMELT, D. 2018. Modeling many-core processor interconnect scalability for the evolving performance, power and area relation.
SULAIMAN, D. R. 2016. The DVS Controller: Analysis and Design. ZANCO Journal of Pure and Applied Sciences, 28.
SULAIMAN, D. R., HAMARASH, I. I. & IBRAHIM, M. A. 2019. The Complete Switching Circuit Design for CPU Joint Body Biasing and Supply Voltage Scaling. ZANCO Journal of Pure and Applied Sciences, 31, 20-25.
TODMAL, A. S. & MUKHERJEE, K. 2017. Design Of An Active Cpu Cooler Design Incoprating Heat Spreader. ASEE Northeast Section Conference. University of Massachusetts Lowell, MA, USA.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2020 Diary R. Sulaiman
This work is licensed under a Creative Commons Attribution 4.0 International License.
